While generally focused on contacts, our engineering talent can be brought to bear on any mechanical, electrical and thermal analysis involving small system components. Experience with hyper-elastic media is at hand to assist in areas outside the "normal" design envelope. Multi-physics analysis can be brought into the fold if the problem complexity necessitates this effort. Experience with several analysis packages is available. Choice of a particular solution depends on requirements of the problem and is generally made to yield the most expedient and cost efficient approach.

MEMS Design
Contact Design
Finite Element Analysis
RF Model Development
Socket & Probe Card Performance

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