Our experience in load board and probe card analysis allows us to quickly and accurately predict whether a given subsystem will meet the specs required for providing consistent high test yield. Margin analyses are available to ensure that variations in path design and in-the-field performance will not result in yield reduction or failure.

Available on-site design assistance together with your engineering team results in maximum speed and efficiency while minimizing the potential for errors.

Production line troubleshooting ensures that quick problem resolutions are available for designs and components that are already in the field.

MEMS Design
Contact Design
Finite Element Analysis
RF Model Development
Socket & Probe Card Performance

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