Subsystem Component Characterization

Interconnects such as backplane connectors, amplifiers and other analog or mixed signal subsystems will be characterized according to customer specifications.

Tests can include the following spectrum:
RF test: S-parameters, time domain signals, simulation results
Inductance and mutual inductance
Capacitance and mutual capacitance
Resistance
Characteristic impedance

DC test:
Current carrying capacity
Temperature rise
Resistance as a function of displacement/force
Power dissipation
Leakage

Models:
Extracted models for contacts and sockets are available using RLC models as well as transmission line model
Equivalent transmission line circuits will be provided where applicable
Complex SPICE circuits and models as well as IBIS models available upon request

Performance parameters:
The following are some of the performance parameters extracted during testing - Insertion loss
Return loss
Crosstalk
Risetime
Bandwidth
Delay
VSWR

Test reports and datasets will be provided as a matter of course.


      Testing
Signal Integrity Assessment

Subsystem Component Characterization

Test Socket Characterization
Probe Card Characterization

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