The electrical analysis of your component or system is centered on developing 3D field solver models that can be used to perform a predictive S-parameter and inductance/capacitance evaluation. With it the high frequency performance of interconnects and other system components can be estimated before a single part is made. This approach ensures that the desired level of signal integrity will be achieved with your design.

Field solver output is used to generate SPICE models capable of estimating frequency domain performance such as S-parameters as well as timed domain quantities like voltages and currents. Impedance levels are extracted and the entire simulation can be combined with existing measurements of actual components. IBIS models are available upon request.

MEMS Design
Contact Design
Finite Element Analysis
RF Model Development
Socket & Probe Card Performance

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